08055E473ZAJ2A [KYOCERA AVX]
Ceramic Capacitor, Multilayer, Ceramic, 50V, 80% +Tol, 20% -Tol, Z5U, -56/+22% TC, 0.047uF, Surface Mount, 0805, CHIP;型号: | 08055E473ZAJ2A |
厂家: | KYOCERA AVX |
描述: | Ceramic Capacitor, Multilayer, Ceramic, 50V, 80% +Tol, 20% -Tol, Z5U, -56/+22% TC, 0.047uF, Surface Mount, 0805, CHIP |
文件: | 总12页 (文件大小:333K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Z5U Dielectric
General Specifications
Z5U formulations are “general-purpose” ceramics which are
meant primarily for use in limited temperature applications
where small size and cost are important. Z5U show wide
variations in capacitance under influence of environmental
and electrical operating conditions.
Despite their capacitance instability, Z5U formulations
are very popular because of their small size, low ESL, low
ESR and excellent frequency response. These features are
particularly important for decoupling application where only a
minimum capacitance value is required.
PART NUMBER (see page 3 for complete part number explanation)
0805
5
E
104
Z
A
T
2
A
Size
(L" x W")
Voltage
25V = 3
50V = 5
Dielectric
Z5U = E
Capacitance Capacitance
Failure
Rate
A = Not
Applicable
Terminations
T = Plated Ni
and Solder
Packaging
2 = 7" Reel
4 = 13" Reel
Special
Code
A = Std.
Product
Code
Tolerance
Preferred
Z = +80%
–20%
M = 20%
PERFORMANCE CHARACTERISTICS
Capacitance Range
0.01 µF to 1.0 µF
Capacitance Tolerances
Preferred +80 –20%
others available: 20%, +100 –0%
+10°C to +85°C
Operating Temperature Range
Temperature Characteristic
Voltage Ratings
+22% to –56% max.
25 and 50VDC (+85°C)
4% max.
Dissipation Factor
Insulation Resistance (+25°C, RVDC)
Dielectric Strength
10,000 megohms min. or 1000 MΩ - µF min., whichever is less
250% of rated voltage for 5 seconds at 50 mamp max. current
Test Voltage
0.5 0.2 Vrms
1 KHz
Test Frequency
12
Z5U Dielectric
Typical Characteristic Curves**
Temperature Coefficient
Variation of Impedance with Cap Value
Impedance vs. Frequency
1206 -Z5U
+30
+20
+10
0
100.00
-10
-20
-30
-40
-50
-60
10.00
1.00
10,000 pF
+10 +25
+45
+50 +55 +65 +85
+30 +35 +40
100,000 pF
Temperature °C
0.10
0.01
100
1,000
1
10
Frequency, MHz
Variation of Impedance with Chip Size
Impedance vs. Frequency
.33 F - Z5U
⌬ Capacitance vs. Frequency
1000
100
10
0
-10
-20
-30
-40
Z5U 1206
Z5U 1210
Z5U 1812
1
1KHz
10 KHz
100 KHz
1 MHz
10 MHz
0.1
0.001
Frequency
100
1,000
0.01
0.1
1
10
Frequency, MHz
Variation of Impedance with Ceramic Formulation
Impedance vs. Frequency
nsu ation Resistance vs Temperature
100,000
10,000
.1F X7R vs. Z5U
0805
10000
X7R 0805
Z5U 0805
1000
1,000
100
0
100
10
1
0.1
+20
+40
+50 +60
+70
+80
+30
Temperature °C
0.01
0.001
100
1,000
0.01
0.1
1
10
Frequency, MHz
SUMMARY OF CAPACITANCE RANGES VS. CHIP SIZE
Style
0603*
0805*
1206*
1210*
1808
25V
50V
.01µF - .047µF
.01µF - .12µF
.01µF - .33µF
.01µF - .56µF
.01µF - .56µF
.01µF - 1.0µF
.01µF - 1.0µF
.01µF - 1.0µF
.01µF - .027µF
.01µF - 0.1µF
.01µF - .33µF
.01µF - .47µF
.01µF - .47µF
.01µF - 1.0µF
.01µF - 1.0µF
.01µF - 1.0µF
1812*
1825*
2225
* Standard Sizes
** For additional information on performance changes with operating conditions consult AVX’s software SpiCap.
13
Z5U Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
0603*
0805
1206
1210
Standard Reel Packaging
All Paper
Paper/Embossed
Paper/Embossed
Paper/Embossed
MM
(in.)
1.60 .15
(.063 .006)
2.01 .20
(.079 .008)
3.20 .20
(.126 .008)
3.20 .20
(.126 .008)
(L) Length
MM
(in.)
.81 .15
(.032 .006)
1.25 .20
(.049 .008)
1.60 .20
(.063 .008)
2.50 .20
(.098 .008)
(W) Width
MM
(in.)
.90
(.035)
1.30
(.051)
1.50
(.059)
1.70
(.067)
(T) Max. Thickness
MM
(in.)
.35 .15
.50 .25
.50 .25
.50 .25
(t) Terminal
WVDC
(.014 .006)
(.020 .010)
(.020 .010)
(.020 .010)
25
50
25
50
25
50
25
50
Cap
(µF)
.010
.012
W
L
᭢
.015
.018
.022
T
᭢
.027
.033
.039
t
.047
.056
.068
.082
.10
.12
.15
.18
.22
.27
.33
.39
.47
.56
.68
.82
1.0
1.5
= Paper Tape
= Embossed Tape
*Reflow soldering only.
NOTES: For low profile chips, see page 19.
14
Z5U Dielectric
Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE
1808*
1812*
1825*
2225*
Standard Reel Packaging
All Embossed
All Embossed
All Embossed
All Embossed
MM
(in.)
04.57 .25
(.180 .010)
4.50 .30
(.177 .012)
4.50 .30
(.177 .012)
5.72 .25
(.225 .010)
L) Length
(
MM
(in.)
2.03 .25
(.080 .010)
3.20 .20
(.126 .008)
6.40 .40
(.252 .016)
6.35 .25
(.250 .010)
(W) Width
MM
(in.)
1.52
(.060)
1.70
(.067)
1.70
(.067)
1.70
(.067)
(T) Max. Thickness
MM
(in.)
.64 .39
.61 .36
.61 .36
.64 .39
(t) Terminal
WVDC
(.025 .015)
(.024 .014)
(.024 .014)
(.025 .015)
25
50
25
50
25
50
25
50
Cap
(µF)
.010
.012
.015
.018
.022
W
L
᭢
T
᭢
.027
.033
.039
t
.047
.056
.068
.082
.10
.12
.15
.18
.22
.27
.33
.39
.47
.56
.68
.82
1.0
1.5
= Paper Tape
= Embossed Tape
*Reflow soldering only.
NOTES: For low profile chips, see page 19.
15
How to Order
Part Number Explanation
EXAMPLE: 08055A101JAT2A
0805
5
A
101
J
A
T
2
A
Size
(L" x W")
0402
0504
0603
0805
1005
0907
1206
1210
1505
1805
1808
1812
1825
2225
3640
Dielectric
C0G (NP0) = A
X7R = C
Capacitance
Tolerance
C = .25 pFꢀ
D = .50 pFꢀ
F = 1ꢁ (≥ 25 pF)
G = 2ꢁ (≥ 13 pF)
J = 5ꢁ
K = 10ꢁ
M = 20ꢁ
Z = +80ꢁ, -20ꢁ
P = +100ꢁ, -0ꢁ
Terminations
Special**
Code
Standard:
T = Ni and Tin
Plated
A = Standard
Product
X5R = D
Z5U = E
Y5V = G
Non-Standard
P = Embossed
unmarked
M = Embossed
marked
E = Standard
packaging
Others:
7 = Plated Ni
Gold Plated
1 = Pd/Ag
marked
Low Profile
Chips Only
Max. Thickness
T = .66mm (.026")
S = .56mm (.022")
R = .46mm (.018")
Voltage
10V = Z
Capacitance
Code
Failure
Rate
A = Not
Applicable
16V = Y
(2 significant
digits + no. of
zeros)
25V = 3
50V = 5
100V = 1
200V = 2
250V = V
500V = 7
600V = C
1000V = A
1500V = S
2000V = G
2500V = W
3000V = H
4000V = J
5000V = K
Examples:
Packaging**
10 pF = 100
100 pF = 101
1,000 pF = 102
Recommended:
2 =7" Reel
4 =13" Reel
22,000 pF = 223
220,000 pF = 224
1 µF = 105
Others:
7 = Bulk Cassette
9 = Bulk
For values below 10 pF,
use “R” in place of
decimal point, e.g., 9.1
pfd = 9R1.
ꢀC&D tolerances for Յ10 pF values.
ꢀꢀ Standard Tape and Reel material depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
Note: Unmarked product is standard. Marked product is available on special request, please contact AVX.
Standard packaging is shown in the individual tables.
Non-standard packaging is available on special request, please contact AVX.
3
Surface Mounting Guide
MLC Chip Capacitors
Component Pad Design
Component pads should be designed to achieve good sol-
der filets and minimize component movement during reflow
soldering. Pad designs are given below for the most com-
mon sizes of multilayer ceramic capacitors for both wave
and reflow soldering. The basis of these designs is:
• Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
• Pad overlap 0.5mm beneath component.
• Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
REFLOW SOLDERING
Case Size
0402
D1
D2
D3
D4
D5
D2
1.70 (0.07)
2.30 (0.09)
3.00 (0.12)
4.00 (0.16)
4.00 (0.16)
5.60 (0.22)
5.60 (0.22)
5.60 (0.22)
6.60 (0.26)
6.60 (0.26)
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04))
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
0.50 (0.02)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
3.60 (0.14)
3.60 (0.14)
3.60 (0.14)
4.60 (0.18)
4.60 (0.18)
0.60 (0.02)
0.80 (0.03)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
1.00 (0.04)
0.50 (0.02)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
2.00 (0.08)
3.00 (0.12)
6.35 (0.25)
5.00 (0.20)
6.35 (0.25)
0603
0805
1206
1210
1808
1812
1825
2220
D1
D3
D4
D5
2225
Dimensions in millimeters (inches)
41
Surface Mounting Guide
MLC Chip Capacitors
WAVE SOLDERING
D2
Case Size
0603
D1
D2
D3
D4
D5
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
5.00 (0.19)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
2.00 (0.09)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
1.50 (0.06)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
2.50 (0.10)
D1
D3
D4
0805
1206
1210
D5
Dimensions in millimeters (inches)
Component Spacing
Preheat & Soldering
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less impor-
tant for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
≥1.5mm (0.06)
≥1mm (0.04)
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
≥1mm (0.04)
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
42
Surface Mounting Guide
MLC Chip Capacitors
General
APPLICATION NOTES
Surface mounting chip multilayer ceramic capacitors
are designed for soldering to printed circuit boards or other
substrates. The construction of the components is such that
they will withstand the time/temperature profiles used in both
wave and reflow soldering methods.
Storage
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
Solderability
Handling
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 5°C for 2 1 seconds.
Chip multilayer ceramic capacitors should be handled with
care to avoid damage or contamination from perspiration
and skin oils. The use of tweezers or vacuum pick ups
is strongly recommended for individual components. Bulk
handling should ensure that abrasion and mechanical shock
are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement
machine. Any mechanical shock should be minimized during
handling chip multilayer ceramic capacitors.
Leaching
Terminations will resist leaching for at least the immersion
times and conditions shown below.
Solder
Tin/Lead/Silver Temp. °C
60/40/0 260 5
Solder
Immersion Time
Seconds
Termination Type
Nickel Barrier
30 1
Preheat
It is important to avoid the possibility of thermal shock during
soldering and carefully controlled preheat is therefore
required. The rate of preheat should not exceed 4°C/second
and a target figure 2°C/second is recommended. Although
an 80°C to 120°C temperature differential is preferred,
recent developments allow a temperature differential
between the component surface and the soldering temper-
ature of 150°C (Maximum) for capacitors of 1210 size and
below with a maximum thickness of 1.25mm. The user is
cautioned that the risk of thermal shock increases as chip
size or temperature differential increases.
Recommended Soldering Profiles
Reflow
300
Natural
Cooling
Preheat
250
200
220°C
150
100
50
to
250°C
Soldering
Mildly activated rosin fluxes are preferred. The minimum
amount of solder to give a good joint should be used.
Excessive solder can lead to damage from the stresses
caused by the difference in coefficients of expansion
between solder, chip and substrate. AVX terminations are
suitable for all wave and reflow soldering systems. If hand
soldering cannot be avoided, the preferred technique is the
utilization of hot air soldering tools.
0
1min
(Minimize soldering time)
10 sec. max
1min
Wave
Cooling
Natural cooling in air is preferred, as this minimizes stresses
within the soldered joint. When forced air cooling is used,
cooling rate should not exceed 4°C/second. Quenching
is not recommended but if used, maximum temperature
differentials should be observed according to the preheat
conditions above.
300
Preheat
Natural
Cooling
250
200
150
100
50
T
230°C
to
Cleaning
250°C
Flux residues may be hygroscopic or acidic and must be
removed. AVX MLC capacitors are acceptable for use with
all of the solvents described in the specifications MIL-STD-
202 and EIA-RS-198. Alcohol based solvents are acceptable
and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful,
and most solvents that are acceptable to other components
on circuit assemblies are equally acceptable for use with
ceramic capacitors.
0
1 to 2 min
3 sec. max
(Preheat chips before soldering)
T/maximum 150°C
43
Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
8mm
12mm
Paper or Embossed Carrier
Embossed Only
0805, 1005, 1206,
1210
0504, 0907
1505, 1805,
1808
1812, 1825
2220, 2225
Paper Only
0402, 0603
2,000 or 4,000(1)
10,000
Qty. per Reel/7" Reel
3,000
1,000
4,000
Qty. per Reel/13" Reel
10,000
(1) Dependent on chip thickness. Low profile chips shown on page 27 are 5,000 per reel for 7" reel. 0402 size chips are 10,000 per 7" reels and are
not available on 13" reels. For 3640 size chip contact factory for quantity per reel.
REEL DIMENSIONS
Tape
A
Max.
B*
Min.
D*
Min.
N
Min.
W2
Max.
C
W1
W3
Size(1)
7.9 Min.
(.311)
8.4+–10..00
14.4
8mm
+.060
(.331
)
(.567)
10.9 Max.
(.429)
–0.0
330
(12.992)
1.5
(.059)
13.0 0.20
(.512 .008)
20.2
(.795)
50
(1.969)
11.9 Min.
(.469)
15.4 Max.
(.607)
12.4+–20..00
18.4
(.724)
12mm
+.076
(.488
)
–0.0
Metric dimensions will govern.
English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.
32
Embossed Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
E
P0
P2
T Max.
T1
G1
G2
8mm
and
12mm
8.4+-00..010
1.75 0.10
4.0 0.10
2.0 0.05
0.600
(.024)
0.10
(.004)
Max.
0.75
0.75
+.004
(.059
-0.0
)
(.069 .004) (.157 .004) (.079 .002)
(.030)
(.030)
Min.
Min.
See Note 3
See Note 4
VARIABLE DIMENSIONS
Tape Size
B1
D1
F
P1
R
T2
W
A0 B0 K0
Max.
Min.
Min.
See Note 6 See Note 5
See Note 2
8.0+-00..13
4.55
1.0
3.5 0.05
4.0 0.10
25
2.5 Max
(.098)
8mm
See Note 1
See Note 1
See Note 1
See Note 1
(.315+-..000142
)
(.179)
(.039)
(.138 .002) (.157 .004)
(.984)
8.2
(.323)
1.5
(.059)
5.5 0.05
(.217 .002) (.157 .004)
4.0 0.10
30
(1.181)
6.5 Max.
(.256)
12.0 .30
(.472 .012)
12mm
8.0+-00..13
8mm
1/2 Pitch
4.55
(.179)
1.0
(.039)
3.5 0.05
(.138 .002) 0.79 .004
2.0 0.10
25
(.984)
2.5 Max.
(.098)
(.315+-..000142
)
12mm
Double
Pitch
8.2
(.323)
1.5
(.059)
5.5 0.05
(.217 .002) (.315 .004)
8.0 0.10
30
(1.181)
6.5 Max.
(.256)
12.0 .30
(.472 .012)
NOTES:
1. A0, B0, and K0 are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the end of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and K0) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches C & D).
2. Tape with components shall pass around radius “R” without damage. The minimum trailer length (Note 2 Fig. 3) may require additional length to provide R min. for 12 mm
embossed tape for reels with hub diameters approaching N min. (Table 4).
3. G1 dimension is the flat area from the edge of the sprocket hole to either the outward deformation of the carrier tape between the embossed cavities or to the edge of the
cavity whichever is less.
4. G2 dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cavity
or to the edge of the cavity whichever is less.
5. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment.
Dimensions of embossment location and hole location shall be applied independent of each other.
6. B1 dimension is a reference dimension for tape feeder clearance only.
33
Paper Carrier Configuration
8 & 12mm Tape Only
8 & 12mm Paper Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
D0
E
P0
P2
T1
G1
G2
R MIN.
+0.1
8mm
and
12mm
1.5 -0.0
1.75 0.10
4.0 0.10
2.0 0.05
0.10
(.004)
Max.
0.75
(.030)
Min.
0.75
(.030)
Min.
25 (.984)
See Note 2
+.004
-.000
(.059
)
(.069 .004) (.157 .004) (.079 .002)
VARIABLE DIMENSIONS
Tape Size
P1
F
W
A0 B0
See Note 1
T
8.0+-00..13
8mm
4.0 0.10
(.157 .004)
3.5 0.05
(.138 .002)
See Note 3
(.315+-..000142
)
4.0 .010
(.157 .004)
5.5 0.05
(.217 .002)
12.0 0.3
(.472 .012)
12mm
8.0+-00..13
8mm
1/2 Pitch
2.0 0.10
(.079 .004)
3.5 0.05
(.138 .002)
(.315+-..000142
)
12mm
Double
Pitch
8.0 0.10
(.315 .004)
5.5 0.05
(.217 .002)
12.0 0.3
(.472 .012)
NOTES:
1. A0, B0, and T are determined by the max. dimensions to the ends of the terminals extending from the component body and/or the body dimensions of the component. The
clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (A0, B0, and T) must be within 0.05 mm (.002) min. and 0.50 mm
(.020) max. The clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches A & B).
2. Tape with components shall pass around radius “R” without damage.
3. 1.1 mm (.043) Base Tape and 1.6 mm (.063) Max. for Non-Paper Base Compositions.
Bar Code Labeling Standard
AVX bar code labeling is available and follows latest version of EIA-556-A.
34
Bulk Case Packaging
BENEFITS
BULK FEEDER
• Easier handling
• Smaller packaging volume
(1/20 of T/R packaging)
• Easier inventory control
• Flexibility
Case
Cassette
• Recyclable
Gate
Shooter
CASE DIMENSIONS
Shutter
Slider
12mm
36mm
Mounter
Head
Expanded Drawing
110mm
Chips
Attachment Base
CASE QUANTITIES
Part Size
0402
0603
0805
Qty.
(pcs / cassette)
10,000 (T=0.6mm)
5,000 (T¯≥0.6mm)
80,000
15,000
35
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